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Material Removal with Laser

Operator: Default included

This process uses laser to remove material.

Description

A high precision laser is used for drilling, milling, selective layer removal or cleaning materials. Materials this process can be used on include: quartz glass, (refractory) metals, polymer thermoplastics, polymer thermohardners, ceramics and thin layers (coatings). After more than 30 years of expertise in laser technology; process development; production and machine manufacturing, this company has the ability to guide you from setting up experiments to implementation in the manufacturing process.

Technical specifications

  • Wavelengths : UV – IR
  • Continues laser power range : mW - 20 kW
  • Continuous laser spot size : min 20 µm
  • Pulsed laser pulse range : msec - femto
  • Pulsed laser power range : 0,5 -9 kW
  • Pulsed laser spot size : 50 - 1000 µm
  • Q-switched laser power range : 1 - 100 kW
  • Q-switched laser frequency : 10 - 100 kHz
  • Q-switched laser spot size : 25 µm